Intel's EMIB packaging technology is emerging as a viable alternative for major chip designers facing TSMC CoWoS capacity constraints. Marvell and MediaTek have both included EMIB in their ASIC design options, signaling a potential shift in advanced packaging preferences.
The move responds to persistent shortages in TSMC's CoWoS advanced packaging capacity, which supports AI chips and high-end processors. Additionally, growing demand for US-based production creates opportunities for Intel's domestic packaging capabilities, as TSMC's American backend facilities remain under development.
EMIB enables efficient interconnection of different chiplets by embedding silicon bridges in the substrate, offering balanced performance, cost, and integration benefits. For Marvell and MediaTek, adopting EMIB provides:
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Diversification from TSMC supply risks
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Access to US-based manufacturing for domestic customers
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Enhanced competitiveness in high-end markets
The interest extends beyond these companies. Recent job postings from Apple, Qualcomm, and Broadcom also reference Intel EMIB technology, indicating broader industry evaluation of the packaging solution.
This trend could reshape the advanced packaging landscape:
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TSMC's CoWoS has dominated high-end packaging
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Intel's EMIB and Foveros portfolio offers competitive alternatives
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The market may evolve toward a "CoWoS + EMIB" dual-track structure
ASIC chips—highly customized for specific applications—are particularly sensitive to packaging choices, making early adoption in this segment strategically significant for Intel.
ICgoodFind:Intel's EMIB gains momentum as supply chain diversification becomes priority for chip designers facing packaging bottlenecks.
