Aug 21 – Xinqiji Microelectronics secured orders from leading domestic packaging firms for its mid-end direct-write lithography equipment, targeting large-size packaging (SoW, CIS, CoWoS-L-like).
Amid AI and high-performance computing growth, its equipment boosts packaging yield via intelligent RDL/PI layer correction, with batch orders expected late 2025-2026. First units will enter mass production lines by year-end, accelerating high-end packaging localization.
Shanghai Xinsang Microelectronics (AMIES) recently delivered its 500th stepper lithography machine, a milestone for China’s high-end semiconductor equipment.
AMIES’ advanced packaging lithography machines (flagship products) offer high resolution, precision overlay, and large exposure fields, supporting Flip-chip and 2.5D/3D packaging. They hold 35% global and 90% domestic market share.
The 500th unit went to Shenghe Jingwei (Jiangyin), a leading wafer-level packaging firm focused on GPU/CPU/AI chip integration and 3DIC development.
Founded in Feb 2025, AMIES specializes in high-end semiconductor equipment (including lithography machines) and aims for international competitiveness in advanced packaging and IC front-end fields.
ICgoodFind: Domestic lithography equipment breakthroughs, shown via mass deliveries, strengthen localization and aid industry upgrading.
