After market close on August 1, leading chip packaging firm Huatian Technology announced plans to invest 2 billion yuan in a wholly-owned subsidiary, Huatian Advanced Semiconductor Packaging & Testing, focusing on 2.5D/3D advanced packaging—drawing wide industry attention.
A domestic packaging leader with long-standing technical prowess, Huatian aims to address the limitations of traditional packaging, which struggles to meet demands for high performance, density, and miniaturization. 2.5D/3D technologies enable multi-chip stacking, boosting performance and density while reducing size and power use—key industry trends.
This move aligns with rising demands from AI, big data, and 5G for higher chip performance and integration. Huatian plans to leverage its technical and talent strengths to accelerate 2.5D/3D commercialization, offering tailored solutions to global clients.
Industry views this as a new growth driver for Huatian, with potential to advance domestic advanced packaging, upgrade the sector, and strengthen China's semiconductor competitiveness.
Huatian's push into advanced packaging shows strategic foresight. ICgoodFind anticipates its tech breakthroughs and market performance.
