Apple, Qualcomm, and Broadcom are shifting toward Intel's EMIB packaging technology for next-generation mobile chips, according to recent hiring trends reported by TechPowerUp. Job postings for packaging engineers at these companies now explicitly require EMIB expertise, signaling a potential expansion of Intel's foundry business beyond process node competition.
EMIB offers distinct advantages for modern chip design:
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Embeds silicon bridges directly within the chip
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Enables high-density die-to-die connections without large silicon interposers
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Provides higher connection density at lower cost
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Optimized for chip-to-HBM integration—critical for AI-enabled mobile processors
This development marks a strategic shift for Intel, whose 18A process previously struggled to attract mobile chip designers due to its focus on medium-to-high power applications. As Qualcomm CEO Cristiano Amon noted, mobile chips are designed "with a battery on the other end, not a wall power source."
However, advanced packaging is becoming increasingly vital as mobile chips integrate more components, particularly HBM memory. While TSMC's CoWoS remains the dominant packaging technology, its limited capacity and higher costs have created an opening for Intel's EMIB as a competitive alternative.
The adoption of EMIB could help:
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Apple enhance performance and power efficiency in A-series chips
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Broadcom improve integration for 5G and IoT communications chips
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Intel diversify its foundry revenue streams
ICgoodFind :Intel's packaging breakthrough creates new competition in advanced semiconductor packaging, potentially reshaping mobile chip supply chains.
