Infineon has launched its 600V CoolGaN™ Drive HB G5 series, packing a complete half-bridge power stage with two 600V CoolGaN™ G5 transistors, a level-shift gate driver, and a bootstrap diode into a tiny 6x8mm TFLGA-27 package.
The result? Compared to discrete solutions, this integration slashes component count by 75% and cuts PCB area in half, while also reducing weight, cost, and system complexity.
Part Numbers:
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IGI60L1414B1M
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IGI60L2727B1M
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IGI60L5050B1M
Key Features:
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Integrated level-shift gate driver & bootstrap diode
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PWM input compatible
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Wide VDD range (10–24V)
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dv/dt rate control
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Zero reverse recovery charge
Performance Meets Thermal Management:
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High-speed switching with propagation delay as low as 98ns, minimal mismatch between channels
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Excellent thermal performance via exposed pad in package
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Single 12V supply for gate driver with fast UVLO recovery
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JEDEC-qualified for industrial apps
Target Applications:
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USB-C adapters & chargers
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HEV DC-DC converters & SRM drives
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Low-power motor drives
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Low-power SMPS
ICgoodFind : Infineon crams the GaN power stage and driver into one chip. Cut your board space in half and slash components by 75%. That's real power design evolution.
