Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Other/Packaging Methods: Tape & Reel (TR)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SI4860DY-T1-E3
|
Vishay Siliconix | 完全替代 | SO-8 |
MOSFET N-CH 30V 11A 8-SOIC
|
||
SI4860DY-T1-E3
|
Vishay Semiconductor | 完全替代 | SOIC |
MOSFET N-CH 30V 11A 8-SOIC
|
||
SI4860DY-T1-E3
|
VISHAY | 完全替代 | SOIC-8 |
MOSFET N-CH 30V 11A 8-SOIC
|
||
SI4860DY-T1-GE3
|
Vishay Siliconix | 类似代替 | SOIC-8 |
MOSFET N-CH 30V 11A 8-SOIC
|
||
SI4860DY-T1-GE3
|
Vishay Semiconductor | 类似代替 |
MOSFET N-CH 30V 11A 8-SOIC
|
|||
SI4888DY-T1-E3
|
Vishay Semiconductor | 类似代替 | SO-8 |
MOSFET, Power; N-Ch; VDSS 30V; RDS(ON) 0.0058Ω; ID 11A; SO-8; PD 1.6W; VGS +/-20V; -55
|
||
SI4888DY-T1-E3
|
Vishay Siliconix | 类似代替 | SO-8 |
MOSFET, Power; N-Ch; VDSS 30V; RDS(ON) 0.0058Ω; ID 11A; SO-8; PD 1.6W; VGS +/-20V; -55
|
||
SI4888DY-T1-E3
|
VISHAY | 类似代替 | SOP |
MOSFET, Power; N-Ch; VDSS 30V; RDS(ON) 0.0058Ω; ID 11A; SO-8; PD 1.6W; VGS +/-20V; -55
|
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