Silan Integration has completed a pioneering 5 billion yuan technology innovation bond issuance, marking a significant fundraising milestone for a Chinese integrated circuit company. The bond was heavily oversubscribed and carries a low coupon rate of 1.6%, reflecting strong market confidence.
The company specializes in providing foundry services for power, sensor, and transmission chips, including MEMS, IGBT, and MOSFET devices. Its one-stop manufacturing solutions serve key sectors like automotive, new energy, and industrial control.
Silan's products have been qualified by major domestic automakers like BYD, XPeng, and NIO and have successfully entered the European market, securing business with a renowned European car manufacturer and international Tier-1 suppliers.
ICgoodFind : This successful bond issuance opens a new financing path for private chip firms, fueling further technology development and market growth.
