Aug 4 - Corelink Integration's H1 2025 results: revenue rose 21.38% YoY to 3.495 billion yuan; net loss narrowed 16.88% to 937 million yuan, with non-GAAP loss down 31.11% to 536 million yuan. Total assets stood at 33.187 billion yuan (-2.97% YoY); net assets reached 12.425 billion yuan (+0.84% YoY)
Loss reduction came from expanded sales and improved profitability via supply chain management and lean production.
Corelink's products cover automotive, industrial control, high-end consumer and AI sectors, focusing on power control, drive, and sensing signal chain chips/modules.
Power control: Runs 8-inch, 12-inch silicon and compound lines (IGBT, MOSFET, SiC MOSFET). Mass production of 12-inch silicon and 8-inch SiC lines boosts automotive and AI growth.
Power IC: Offers high-voltage/current/density solutions, automotive-grade foundry. Advanced BCD platforms under development; BCDSOI used in automotive BMSAFE. 55nm MCU platform completed, next-gen in R&D.
Sensing signal chain: Silicon microphones, LiDAR galvanometers support new energy/intelligent industries. 3rd-gen mics mass-produced, 4th-gen iterating. Automotive motion sensors in production; MEMS mics for AI voice, with 5th-gen and AI chips under development.
ICgoodFind sees Corelink's strong H1 growth, loss reduction and solid layout as promising.
