According to a JPMorgan report cited by industry sources, TSMC’s 2nm process technology has seen tape-out volumes reach 1.5 times that of the 3nm process at the same stage. This technological lead is expected to help TSMC secure over 95% of the global AI accelerator market, further solidifying its absolute dominance in advanced semiconductor manufacturing.
Tape-out refers to the critical step of delivering completed chip designs to the foundry for initial sample production—akin to laying the foundation in construction. The significant increase in tape-out volume directly reflects strong global demand for the 2nm node and underscores the high-end chip shortage amid the ongoing AI boom. To meet this demand, TSMC has set an aggressive expansion plan, aiming to boost 2nm wafer capacity to 140,000 wafers per month by the end of 2026. This scale will provide essential manufacturing support for high-performance computing and indicates the global high-end computing supply chain’s continued reliance on TSMC.
This explosive capacity expansion is reshaping TSMC’s revenue mix. Analysts project that 2nm process revenue will surpass the combined revenue from 3nm and 5nm processes by the third quarter of 2026, becoming a new core growth engine for the company—driven largely by exponential AI-related demand.
In the intense competition for capacity, TSMC’s largest customer, Apple, has once again demonstrated its supply chain influence. Apple has reportedly secured over 50% of TSMC’s initial 2nm capacity, which will be used primarily for the A20 and A20 Pro chips in the iPhone 18 series, as well as the M6 chip for the OLED MacBook Pro, laying a strong performance foundation for next-generation flagship consumer electronics.
ICgoodFind Perspective: TSMC’s strong push in 2nm technology is set to reshape the global chip industry landscape. We are committed to helping industry players access premium resources and seize opportunities in the advanced node era.
