On August 12, TSMC announced at its latest board meeting plans to phase out 6-inch wafer manufacturing within 2 years and continue consolidating 8-inch capacity, aiming to optimize operations and enhance efficiency after thorough evaluation.
TSMC stated the decision aligns with market trends and long-term business strategies. It is collaborating closely with clients to ensure a smooth transition, maintaining supply during the period to create value for partners and the market.
Currently, TSMC operates 4 large-scale 12-inch fabs (multiple phases), 4 8-inch fabs, and 1 6-inch fab in Taiwan. It emphasized the 6-inch exit will not impact previously announced financial targets.
ICgoodFind: TSMC’s capacity adjustment focuses on efficiency, with strategic shifts warranting market attention.
