Aug 28 – TSMC plans to accelerate construction of a new 1.4nm advanced process plant, with groundbreaking set for October. Total investment is expected to reach NT$1.2T–1.5T (approx. RMB280.74B–350.92B).
Reportedly, TSMC will build the F25 semiconductor factory (with 4 facilities) in the Central Taiwan Science Park:
- The first facility is slated for trial production by end-2027 and mass production in H2 2028, with expected revenue exceeding NT$500B.
- The first two facilities will adopt 1.4nm process; the second phase may upgrade to 1nm.
Additionally, TSMC’s Fab 20 Phase 2 (Hsinchu Baoshan) will be converted into 1.4nm process and R&D lines; its third facility will use 1nm, while the fourth may potentially deploy 0.7nm. TSMC has requested suppliers to prepare equipment for 1.4nm and plans to install a trial production line in Baoshan Phase 2—indicating smooth technological progress.
ICgoodFind: TSMC’s accelerated 1.4nm advanced process construction will further solidify its leadership in semiconductors and exert a significant impact on the global semiconductor industry’s development.
