Semiconductor manufacturing is entering a new phase of atomic-scale precision as Applied Materials unveils a suite of high-accuracy tools capable of 0.1 nanometer control. Designed to meet the demands of next-generation logic and memory chips, these innovations target complex production challenges like 2nm processes and gate-all-around (GAA) transistor architectures.
The new portfolio includes the Kinex™ integrated chip-to-wafer hybrid bonding system for finer interconnects, the Centura™ Xtera™ Epi deposition system optimized for GAA transistors, and metrology tools providing sub-nanometer imaging. Leading manufacturers such as TSMC, Intel, Samsung, and SK Hynix have adopted these systems to accelerate production of advanced logic, HBM memory, and 3D chip stacking.
Despite strong industry momentum—with 100 new fabs under construction globally—U.S. export restrictions bar Chinese clients from accessing these tools, costing Applied Materials an estimated $600 million in FY2026 revenue.
ICgoodFind Summary: Atomic-level tools are reshaping advanced chip production, though geopolitical barriers continue to fragment the global supply chain.
