Sep 11 - HiSilicon Technologies Co., Ltd., Huawei’s core chip design subsidiary, has announced a major leadership reshuffle: Xu Zhijun stepped down as legal representative and chairman, with Gao Ji taking over the roles. Multiple other senior executive adjustments were also made, marking HiSilicon’s entry into a new management cycle.
In detail: Hu Houkun and Guo Ping resigned as directors (replaced by Zhang Lei, who also serves as CFO, and Hu Bo); Ren Shulu stepped down as supervisor (succeeded by Zhu Wen); while He Tingbo remains as general manager. This reshuffle is expected to boost HiSilicon’s future development.
Background: Xu Zhijun (PhD from Nanjing University of Science and Technology) joined Huawei in 1993, holding roles like Wireless Product Line President and Huawei Rotating Chairman (April-Sept 2025). His departure is likely linked to Huawei’s rotating duty system. Gao Ji, current HiSilicon CEO and a senior Huawei technical manager, has long focused on semiconductors and led R&D/commercialization of key HiSilicon chips—his appointment underscores Huawei’s focus on HiSilicon’s tech innovation.
Founded in Oct 2004 (registered capital 2 billion RMB), HiSilicon (wholly owned by Huawei) specializes in semiconductor design, sales and import/export, and is a core part of Huawei’s chip supply chain.
The management change is a key adjustment to Huawei’s semiconductor layout. The industry is watching if the new team can drive HiSilicon’s chip design breakthroughs and sustain core chip support for Huawei.
ICgoodFind : HiSilicon’s leadership change is a key development milestone. The new team may speed up its chip R&D and commercialization, adding vitality to the semiconductor industry.
