Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BQ4010YMA-200
|
TI | 类似代替 | DIP-28 |
为8K ×8非易失性SRAM ( 5 V , 3.3 V ) 8 k x 8 NONVOLATILE SRAM (5 V, 3.3 V)
|
||
DS1225AB-200+
|
Maxim Integrated | 功能相似 | EDIP-28 |
MAXIM INTEGRATED PRODUCTS DS1225AB-200+ 芯片, 存储器, NVRAM
|
||
DS1225AB-200+
|
Dallas Semiconductor | 功能相似 | 720 EMOD |
MAXIM INTEGRATED PRODUCTS DS1225AB-200+ 芯片, 存储器, NVRAM
|
||
DS1225Y-200
|
Dallas Semiconductor | 功能相似 | DIP |
NVRAM NVSRAM Parallel 64Kbit 5V 28Pin EDIP
|
||
DS1225Y-200+
|
Maxim Integrated | 功能相似 | EDIP-28 |
Non-Volatile SRAM Module, 8KX8, 200ns, CMOS, 0.72INCH, ROHS COMPLIANT, DIP-28
|
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