Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS1225AB-200+
|
Maxim Integrated | 功能相似 | EDIP-28 |
MAXIM INTEGRATED PRODUCTS DS1225AB-200+ 芯片, 存储器, NVRAM
|
||
DS1225AB-200+
|
Dallas Semiconductor | 功能相似 | 720 EMOD |
MAXIM INTEGRATED PRODUCTS DS1225AB-200+ 芯片, 存储器, NVRAM
|
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