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Model CY7C1370D-167BZC
Description 1818 Mbit (512K x 36/1M x 18) pipelined SRAM with NoBL Architecture
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Brand: Cypress Semiconductor
Packaging LBGA
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Packaging method
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(1231) Minimum order quantity(1)
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Encapsulation parameters/Encapsulation: LBGA

External dimensions/packaging: LBGA

Other/Product Lifecycle: Unknown

Compliant with standards/RoHS standards: RoHS Compliant

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
CY7C1370C-200BZI CY7C1370C-200BZI Cypress Semiconductor 功能相似 BGA
512K ×36 / 1M ×18的SRAM流水线与NOBL架构 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
PDF
CY7C1370D-167BZXC CY7C1370D-167BZXC Cypress Semiconductor 功能相似 FBGA-165
18兆位（ 512K的X 36/1的M× 18 ）流水线SRAM与NOBL架构 18-Mbit (512 K x 36/1 M x 18) Pipelined SRAM with NoBL Architecture
PDF
CY7C1370D-200BZC CY7C1370D-200BZC Cypress Semiconductor 功能相似 FBGA-165
18兆位（ 512K的X 36/1的M× 18 ）流水线SRAM与NOBL架构 18-Mbit (512 K x 36/1 M x 18) Pipelined SRAM with NoBL Architecture
PDF

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