Technical parameters/power supply voltage (DC): 3.30 V, 3.60 V (max)
Technical parameters/clock frequency: 167MHz (max)
Technical parameters/digits: 36
Technical parameters/access time: 3.4 ns
Technical parameters/memory capacity: 18000000 B
Technical parameters/access time (Max): 3.4 ns
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 3.135V ~ 3.6V
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 3.135 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: FBGA-165
External dimensions/height: 0.89 mm
External dimensions/packaging: FBGA-165
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1370C-200BZI
|
Cypress Semiconductor | 功能相似 | BGA |
512K ×36 / 1M ×18的SRAM流水线与NOBL架构 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
|
||
CY7C1370D-200BZC
|
Cypress Semiconductor | 类似代替 | FBGA-165 |
18兆位（ 512K的X 36/1的M× 18 ）流水线SRAM与NOBL架构 18-Mbit (512 K x 36/1 M x 18) Pipelined SRAM with NoBL Architecture
|
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