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Model CY7C1370D-200BZC
Description 18Megabit (512K x 36/1 M x 18) pipelined SRAM and NOBL architecture 18 Mbit (512 K x 36/1 M x 18) pipelined SRAM with NoBL architecture
Product QR code
Brand: Cypress Semiconductor
Packaging FBGA-165
Delivery time
Packaging method Tray
Standard packaging quantity 1
48.75  yuan 48.75yuan
1+:
$ 59.4738
10+:
$ 56.0614
100+:
$ 53.5264
250+:
$ 53.1364
500+:
$ 52.7464
1000+:
$ 52.3077
2500+:
$ 51.9177
5000+:
$ 51.6739
Quantity
1+
10+
100+
250+
500+
Price
$59.4738
$56.0614
$53.5264
$53.1364
$52.7464
Price $ 59.4738 $ 56.0614 $ 53.5264 $ 53.1364 $ 52.7464
Start batch production 1+ 10+ 100+ 250+ 500+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(5866) Minimum order quantity(1)
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Technical parameters/digits: 36

Technical parameters/access time: 3 ns

Technical parameters/access time (Max): 3 ns

Technical parameters/operating temperature (Max): 70 ℃

Technical parameters/operating temperature (Min): 0 ℃

Technical parameters/power supply voltage: 3.135V ~ 3.6V

Technical parameters/power supply voltage (Max): 3.6 V

Technical parameters/power supply voltage (Min): 3.135 V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 165

Encapsulation parameters/Encapsulation: FBGA-165

External dimensions/height: 0.89 mm

External dimensions/packaging: FBGA-165

Physical parameters/operating temperature: 0℃ ~ 70℃

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards:

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
CY7C1370C-200BZI CY7C1370C-200BZI Cypress Semiconductor 功能相似 BGA
512K ×36 / 1M ×18的SRAM流水线与NOBL架构 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
PDF
CY7C1370D-167BZXC CY7C1370D-167BZXC Cypress Semiconductor 类似代替 FBGA-165
18兆位（ 512K的X 36/1的M× 18 ）流水线SRAM与NOBL架构 18-Mbit (512 K x 36/1 M x 18) Pipelined SRAM with NoBL Architecture
PDF

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