Technical parameters/digits: 36
Technical parameters/access time (Max): 3 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: BGA
External dimensions/height: 0.79 mm
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1370D-167BZXC
|
Cypress Semiconductor | 功能相似 | FBGA-165 |
18兆位( 512K的X 36/1的M× 18 )流水线SRAM与NOBL架构 18-Mbit (512 K x 36/1 M x 18) Pipelined SRAM with NoBL Architecture
|
||
CY7C1370D-200BZC
|
Cypress Semiconductor | 功能相似 | FBGA-165 |
18兆位( 512K的X 36/1的M× 18 )流水线SRAM与NOBL架构 18-Mbit (512 K x 36/1 M x 18) Pipelined SRAM with NoBL Architecture
|
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