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Model CY7C1360C-166BZXI
Description 9Megabit (256K x 36/512K x 18) pipelined SRAM 9-Mbit (256K x 36/512K x 18) pipelined SRAM
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Brand: Cypress Semiconductor
Packaging BGA
Delivery time
Packaging method
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(4845) Minimum order quantity(1)
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Technical parameters/digits: 36

Technical parameters/access time (Max): 3.5 ns

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -40 ℃

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 165

Encapsulation parameters/Encapsulation: BGA

External dimensions/height: 0.89 mm

External dimensions/packaging: BGA

Other/Product Lifecycle: Unknown

Compliant with standards/RoHS standards: RoHS Compliant

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
CY7C1360B-166BZI CY7C1360B-166BZI Cypress Semiconductor 功能相似 TBGA
9兆位（ 256K ×36 / 512K ×18 ）流水线式SRAM 9-Mbit (256K x 36/512K x 18) Pipelined SRAM
CY7C1360C-166BZI CY7C1360C-166BZI Cypress Semiconductor 完全替代 FBGA-165
9兆位（ 256K ×36 / 512K ×18 ）流水线式SRAM 9-Mbit (256K x 36/512K x 18) Pipelined SRAM
PDF
CY7C1360C-166BZI CY7C1360C-166BZI Rochester 完全替代 LBGA
9兆位（ 256K ×36 / 512K ×18 ）流水线式SRAM 9-Mbit (256K x 36/512K x 18) Pipelined SRAM
CY7C1360C-200BGC CY7C1360C-200BGC Cypress Semiconductor 功能相似 BGA-119
9兆位（ 256K ×36 / 512K ×18 ）流水线式SRAM 9-Mbit (256K x 36/512K x 18) Pipelined SRAM
PDF

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