Encapsulation parameters/Encapsulation: LBGA
External dimensions/packaging: LBGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1360B-166BZI
|
Cypress Semiconductor | 功能相似 | TBGA |
9兆位( 256K ×36 / 512K ×18 )流水线式SRAM 9-Mbit (256K x 36/512K x 18) Pipelined SRAM
|
||
CY7C1360C-166BZXI
|
Cypress Semiconductor | 完全替代 | BGA |
9兆位( 256K ×36 / 512K ×18 )流水线式SRAM 9-Mbit (256K x 36/512K x 18) Pipelined SRAM
|
||
CY7C1360C-200BGC
|
Cypress Semiconductor | 功能相似 | BGA-119 |
9兆位( 256K ×36 / 512K ×18 )流水线式SRAM 9-Mbit (256K x 36/512K x 18) Pipelined SRAM
|
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