Package parameters/number of pins: | 165 |
|
Encapsulation parameters/Encapsulation: | TBGA |
|
Dimensions/Packaging: | TBGA |
|
Other/Product Lifecycle: | Unknown |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1360C-166BZI
|
Cypress Semiconductor | 功能相似 | FBGA-165 |
9兆位( 256K ×36 / 512K ×18 )流水线式SRAM 9-Mbit (256K x 36/512K x 18) Pipelined SRAM
|
||
|
|
Rochester | 功能相似 | LBGA |
9兆位( 256K ×36 / 512K ×18 )流水线式SRAM 9-Mbit (256K x 36/512K x 18) Pipelined SRAM
|
||
CY7C1360C-200BGC
|
Cypress Semiconductor | 功能相似 | BGA-119 |
9兆位( 256K ×36 / 512K ×18 )流水线式SRAM 9-Mbit (256K x 36/512K x 18) Pipelined SRAM
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review