Technical parameters/digits: 8
Technical parameters/access time (Max): 25000 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 63
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
NAND02GR3B2DZA6E
|
Micron | 功能相似 | TFBGA-63 |
NAND Flash Parallel 1.8V 2G-bit 256M x 8 25us 63Pin VFBGA Tray
|
||
NAND02GR3B2DZA6E
|
Numonyx | 功能相似 | VFBGA-63 |
NAND Flash Parallel 1.8V 2G-bit 256M x 8 25us 63Pin VFBGA Tray
|
||
|
|
ST Microelectronics | 功能相似 | FBGA |
2-Gbit, 2112Byte/1056-word page multiplane architecture, 1.8V or 3V, NAND flash memories
|
||
|
|
Numonyx | 功能相似 | VFBGA-63 |
2-Gbit, 2112Byte/1056-word page multiplane architecture, 1.8V or 3V, NAND flash memories
|
||
NAND02GW3B2DZA6E
|
Micron | 功能相似 | TFBGA-63 |
2-Gbit, 2112Byte/1056-word page multiplane architecture, 1.8V or 3V, NAND flash memories
|
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