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Home Page   Classification of electronic components   NAND02GW3B2DZA6E
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Model NAND02GW3B2DZA6E
Description IC,EEPROM,NAND FLASH,256MX8,CMOS,BGA,63PIN,PLASTIC
Product QR code
Brand: ST Microelectronics
Packaging FBGA
Delivery time
Packaging method
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(9360) Minimum order quantity(1)
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Package parameters/number of pins:

63

 

Encapsulation parameters/Encapsulation:

FBGA

 

Dimensions/Packaging:

FBGA

 

Other/Product Lifecycle:

Unknown

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
NAND02GR3B2DZA6E NAND02GR3B2DZA6E Micron 功能相似 TFBGA-63
2-Gbit, 2112Byte/1056-word page multiplane architecture, 1.8V or 3V, NAND flash memories
PDF
NAND02GR3B2DZA6E NAND02GR3B2DZA6E Numonyx 功能相似 VFBGA-63
2-Gbit, 2112Byte/1056-word page multiplane architecture, 1.8V or 3V, NAND flash memories
PDF
NAND02GR3B2DZA6F NAND02GR3B2DZA6F Micron 功能相似 BGA
2-Gbit, 2112Byte/1056-word page multiplane architecture, 1.8V or 3V, NAND flash memories
PDF
NAND02GW3B2CZA6F NAND02GW3B2CZA6F Micron 功能相似 BGA
1千兆， 2千兆， 2112字节/ 1056字页， 1.8V / 3V ， NAND闪存 1 Gbit, 2 Gbit, 2112 Byte/1056 Word Page, 1.8V/3V, NAND Flash Memory

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