Technical parameters/power supply voltage: | 1.7V ~ 1.95V |
|
Package parameters/number of pins: | 63 |
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Encapsulation parameters/Encapsulation: | TFBGA-63 |
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Dimensions/Packaging: | TFBGA-63 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: |
| |
Compliant with standards/lead standards: | lead-free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
NAND02GR3B2CZA6E
|
ST Microelectronics | 类似代替 | BGA |
NAND Flash Parallel 1.8V 2G-bit 256M x 8 25us 63Pin VFBGA Tray
|
||
NAND02GR3B2DZA6F
|
Micron | 类似代替 | BGA |
NAND Flash Parallel 1.8V 2Gbit 256M x 8Bit 25us 63Pin VFBGA T/R
|
||
|
|
ST Microelectronics | 功能相似 | FBGA |
2-Gbit, 2112Byte/1056-word page multiplane architecture, 1.8V or 3V, NAND flash memories
|
||
|
|
Numonyx | 功能相似 | VFBGA-63 |
2-Gbit, 2112Byte/1056-word page multiplane architecture, 1.8V or 3V, NAND flash memories
|
||
NAND02GW3B2DZA6E
|
Micron | 功能相似 | TFBGA-63 |
2-Gbit, 2112Byte/1056-word page multiplane architecture, 1.8V or 3V, NAND flash memories
|
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