Technical parameters/Contact electroplating: Gold
Technical parameters/insulation resistance: 1000 MΩ
Encapsulation parameters/installation method: Panel
Physical parameters/contact material: Beryllium Copper
Physical parameters/materials: Brass
Physical parameters/medium materials: Teflon
Physical parameters/insulation material: Teflon
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
37-05-TGG
|
Multicomp | 类似代替 |
MULTICOMP 37-05-TGG 射频/同轴连接器, MMCX同轴, 直型隔板安装插座, 焊接, 50 ohm, 铍铜
|
|||
82 MMCX-50-0-1/111 NE
|
Suhner | 功能相似 |
HUBER & SUHNER 82 MMCX-50-0-1/111 NE 射频/同轴连接器, MMCX同轴, 直型插座, 焊接, 50 ohm, 铍铜
|
|||
82MMCX-S50-0-2/111KE
|
Suhner | 功能相似 |
HUBER & SUHNER 82MMCX-S50-0-2/111KE 射频/同轴连接器, MMCX同轴, 直型插座, 焊接, 50 ohm, 铍铜
|
|||
85 MMCX-50-0-1/111OH
|
Suhner | 功能相似 |
HUBER & SUHNER 85 MMCX-50-0-1/111OH 射频/同轴连接器, MMCX同轴, 直角插座, 通孔安装 直角, 50 ohm, 铍铜
|
|||
85 MMCX-50-0-1/111OH
|
Huber & Suhner | 功能相似 |
HUBER & SUHNER 85 MMCX-50-0-1/111OH 射频/同轴连接器, MMCX同轴, 直角插座, 通孔安装 直角, 50 ohm, 铍铜
|
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