Technical parameters/Contact electroplating: Gold
Technical parameters/insulation resistance: 10.0 GΩ
Technical parameters/Contact resistance: 2.50 mΩ
Technical parameters/number of plug and unplug cycles: 500
Technical parameters/operating temperature (Max): 155 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Through Hole
External dimensions/height: 3.8 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/materials: Brass
Physical parameters/medium materials: Teflon
Physical parameters/insulation material: Teflon
Physical parameters/operating temperature: -55℃ ~ 155℃
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: RF Communications, Industrial, Industrial, RF Communications
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
37-07-1-TGG
|
Multicomp | 功能相似 |
MULTICOMP 37-07-1-TGG 射频/同轴连接器, MMCX同轴, 直角插座, 焊接, 50 ohm, 铍铜
|
|||
73415-1001
|
Molex | 功能相似 |
MOLEX 73415-1001. 射频/同轴连接器, MMCX
|
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