Technical parameters/Contact electroplating: Gold
Encapsulation parameters/installation method: Through Hole
Physical parameters/contact material: Beryllium Copper
Physical parameters/materials: Brass
Physical parameters/insulation material: Teflon
Other/Product Lifecycle: Unknown
Other/Manufacturing Applications: Industrial, Aerospace, Industry, Defence, Communications and Networks, Military and Aviation, Defense, Communications&Networking, Military
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standards/military grade: Yes
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
85 MMCX-50-0-1/111OH
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Suhner | 类似代替 |
HUBER & SUHNER 85 MMCX-50-0-1/111OH 射频/同轴连接器, MMCX同轴, 直角插座, 通孔安装 直角, 50 ohm, 铍铜
|
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85 MMCX-50-0-1/111OH
|
Huber & Suhner | 类似代替 |
HUBER & SUHNER 85 MMCX-50-0-1/111OH 射频/同轴连接器, MMCX同轴, 直角插座, 通孔安装 直角, 50 ohm, 铍铜
|
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