Encapsulation parameters/installation method: Through Hole
Physical parameters/contact material: Beryllium Copper
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
37-07-1-TGG
|
Multicomp | 功能相似 |
MULTICOMP 37-07-1-TGG 射频/同轴连接器, MMCX同轴, 直角插座, 焊接, 50 ohm, 铍铜
|
|||
73415-1001
|
Molex | 功能相似 |
MOLEX 73415-1001. 射频/同轴连接器, MMCX
|
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