Technical parameters/Contact electroplating: Gold
Encapsulation parameters/installation method: Through Hole
Physical parameters/contact material: Beryllium Copper
Physical parameters/materials: Brass
Physical parameters/insulation material: Teflon
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standards/military grade: Yes
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1408496-1
|
TE Connectivity | 类似代替 | Through Hole |
AMP FROM TE CONNECTIVITY 1408496-1 射频/同轴连接器, MMCX
|
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