Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-236
External dimensions/packaging: TO-236
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Philips | 功能相似 | TO-236 |
Nexperia BCV27,215 NPN 达林顿晶体管对, 500 mA, Vce=30 V, HFE=4000, 3引脚 SOT-23 (TO-236AB)封装
|
||
BCV27,215
|
Nexperia | 功能相似 | SOT-23-3 |
Nexperia BCV27,215 NPN 达林顿晶体管对, 500 mA, Vce=30 V, HFE=4000, 3引脚 SOT-23 (TO-236AB)封装
|
||
BCV27,215
|
NXP | 功能相似 | SOT-23-3 |
Nexperia BCV27,215 NPN 达林顿晶体管对, 500 mA, Vce=30 V, HFE=4000, 3引脚 SOT-23 (TO-236AB)封装
|
||
BCV27TA
|
Diodes | 功能相似 | SOT-23-3 |
TRANS DARL NPN 500mA 30V SOT23-3
|
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