Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-236
External dimensions/packaging: TO-236
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BCV27TA
|
Diodes | 功能相似 | SOT-23-3 |
TRANS DARL NPN 500mA 30V SOT23-3
|
||
MMBTA13LT1G
|
ON Semiconductor | 功能相似 | SOT-23-3 |
ON SEMICONDUCTOR MMBTA13LT1G 单晶体管 双极, NPN, 30 V, 125 MHz, 225 mW, 300 mA, 10000 hFE
|
||
PMBTA14,215
|
Nexperia | 类似代替 | SOT-23-3 |
PMBTA14 系列 30 V 500 mA 表面贴装 NPN 达林顿晶体管 - SOT-23-3
|
||
PMBTA14,215
|
NXP | 类似代替 | SOT-23-3 |
PMBTA14 系列 30 V 500 mA 表面贴装 NPN 达林顿晶体管 - SOT-23-3
|
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