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Model BC860C

Description NXP BC860C 单晶体管双极, 通用, PNP, 45 V, 100 MHz, 250 mW, 100 mA, 420 hFE

Brand: NXP

Packaging SOT-23

Delivery time

Packaging method Cut Tape (CT)

Standard packaging quantity 1

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Technical parameters/number of pins:	3
Technical parameters/polarity:	PNP
Technical parameters/dissipated power:	250 mW
Technical parameters/minimum current amplification factor (hFE):	420
Technical parameters/DC current gain (hFE):	420
Technical parameters/operating temperature (Max):	150 ℃
Technical parameters/operating temperature (Min):	-65 ℃
Technical parameters/dissipated power (Max):	0.25 W
Encapsulation parameters/installation method:	Surface Mount
Package parameters/number of pins:	3
Encapsulation parameters/Encapsulation:	SOT-23
Dimensions/Length:	3 mm
Dimensions/Width:	1.4 mm
Dimensions/Height:	1 mm
Dimensions/Packaging:	SOT-23
Other/Product Lifecycle:	Unknown
Other/Packaging Methods:	Cut Tape (CT)
Other/Manufacturing Applications:	Audio, Audio
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	Lead Free
Compliant with the REACH SVHC standard:	No SVHC
Compliant with standard/REACH SVHC version:	2015/12/17

Alternative material

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BCX71H	Central Semiconductor	类似代替		NXP BCX71H 单晶体管双极, 通用, PNP, 45 V, 250 mW, 100 mA, 180 hFE
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BCX71H	Siemens AG	类似代替	SOT-23	NXP BCX71H 单晶体管双极, 通用, PNP, 45 V, 250 mW, 100 mA, 180 hFE	PDF
BCX71H	Philips	类似代替	TO-236	NXP BCX71H 单晶体管双极, 通用, PNP, 45 V, 250 mW, 100 mA, 180 hFE	PDF