Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-236
External dimensions/packaging: TO-236
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BC860C
|
NXP | 类似代替 | SOT-23 |
NXP BC860C 单晶体管 双极, 通用, PNP, 45 V, 100 MHz, 250 mW, 100 mA, 420 hFE
|
||
BC860C
|
Kexin | 类似代替 |
NXP BC860C 单晶体管 双极, 通用, PNP, 45 V, 100 MHz, 250 mW, 100 mA, 420 hFE
|
|||
|
BCX71H,215
|
Philips | 功能相似 | TO-236 |
NXP BCX71H,215 单晶体管 双极, PNP, -45 V, 100 MHz, 250 mW, -100 mA, 180 hFE
|
||
BCX71H,215
|
Nexperia | 功能相似 | SOT-23-3 |
NXP BCX71H,215 单晶体管 双极, PNP, -45 V, 100 MHz, 250 mW, -100 mA, 180 hFE
|
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