Texas Instruments (TI) has officially opened its second assembly and test plant in Malacca, Malaysia—TIEM2. The new facility is capable of processing billions of analog and embedded chips annually, serving key sectors such as automotive, industrial, and consumer electronics.
The six-story factory connects to existing infrastructure, expanding TI’s local footprint from 500,000 to 1.4 million square feet. With a total potential investment of RM 5 billion (approx. $10.2 billion), the plant is expected to create 500 new local jobs at full operation.
This expansion supports TI’s strategic goal to internalize 90% of its assembly and test operations by 2030, reducing reliance on third-party suppliers and strengthening global supply chain resilience. The facility incorporates advanced packaging technologies, accommodating everything from low-power to high-power chips and standard to custom solutions, enabling faster response to customer demands.
ICgoodFind:TI’s investment in Malaysia reinforces its leadership in analog chips while securing supply capacity for high-demand global markets.
