Chinese chipmaker Silan Microelectronics has signed a strategic agreement with the Xiamen government to build a state-of-the-art 12-inch analog IC production line.
The project, with a total planned investment of ¥20 billion, will operate on an IDM (Integrated Device Manufacturer) model. It will be constructed in two phases in Xiamen's Haicang District.
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Phase One: Involving an investment of ¥10 billion, it is scheduled to commence construction by the end of 2025. Initial production is expected in Q4 2027, with full capacity reached by 2030. This phase will establish an annual production capacity of 240,000 12-inch wafers.
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Phase Two: An additional ¥10 billion will be invested to expand capacity further, adding 300,000 wafers of annual output.
ICgoodFind : This major investment significantly boosts China's domestic capacity for high-end analog chips, enhancing supply chain self-sufficiency.
