At the 25th IOTE International Internet of Things Exhibition in Shenzhen, Telink Semiconductor is launching its next‑generation TL323X IoT SoC – a multi‑protocol, low‑power wireless chip that consolidates Bluetooth 6.1, Channel Sounding, Matter, Thread, Zigbee, Aliro, Apple Find My, Google Nearby, and Amazon Sidewalk into a single platform. The device supports concurrent Bluetooth, Zigbee, and Thread operation over a shared RF architecture, cutting BOM cost and idle power for smart home, smart locks, metering, asset tracking, precision positioning, and outdoor equipment.
Live demos at the booth showcase real‑world performance:
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Bluetooth Channel Sounding delivers centimeter‑level ranging for digital car keys and indoor asset location.
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Smart finder tags leverage ultra‑low sleep current for extended battery life, with cross‑platform offline location support.
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Amazon Sidewalk bridging enables flexible switching between BLE short‑range and Sub‑GHz long‑range communication.
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Matter‑based whole‑home control shows seamless interoperability across brands.
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Multi‑mode gateway runs BLE, Zigbee, and Thread simultaneously via TDM and co‑scheduling, mitigating interference in mixed‑ecosystem smart homes.
Beyond the TL323X, the demo area features five live solution clusters – wireless gaming, audio, voice UI, outdoor comms, and asset tracking – alongside production‑ready end devices. Telink’s FAE, marketing, and sales teams are on‑site for one‑on‑one technical deep‑dives, custom design consultations, and project matching.
As a board member of both the Bluetooth SIG and CSA Alliance, Telink brings deep protocol expertise to this release, backed by a complete SDK and reference designs covering development, test, and mass production.
ICgoodFind Takeaway:
Multi‑protocol convergence simplifies IoT hardware design. The TL323X expands the low‑power wireless selection – one chip, many standards, fewer trade‑offs.
