Nexchip Integration announced on October 17 that its subsidiary, Wanxin Integration, secured a 3 billion yuan cash injection from majority shareholder Hefei Construction Investment through a capital increase. The funding will accelerate R&D and capacity expansion for advanced semiconductor projects.
Hefei Construction Investment subscribed to 2.84 billion yuan in new registered capital, boosting Wanxin’s registered capital from 9.589 billion to 12.429 billion yuan. Nexchip waived its preemptive rights, reducing its stake from 43.75% to 33.75%, but retains control as the largest shareholder with a board majority.
The capital will drive projects in 55nm to 28nm process technologies, including display driver chips, CIS chips, and power management chips for consumer electronics, automotive, and industrial applications. Wanxin aims to establish a 12-inch wafer production line with a monthly capacity of 50,000 wafers.
Nexchip brings foundational expertise in 12-inch wafer foundry, such as mass-producing 40nm high-voltage OLED chips and developing 28nm nodes for AR/VR technologies, enabling synergies with Wanxin’s expansion.
ICgoodFind : This investment strengthens local semiconductor capabilities, supporting regional cluster development and supply chain resilience.
