On September 22, MediaTek is set to unveil its new flagship chipset, the Dimensity 9500. According to supply chain sources, the chip will be built on TSMC’s latest 3rd-gen 3nm process (N3P), giving it a significant advantage in manufacturing technology.
MediaTek’s General Manager, Jeff Chen, previously expressed strong confidence in the Dimensity 9500, emphasizing that it will stand out in the market—especially in AI performance. The chip is expected to feature a new NPU architecture that doubles AI computing power, delivering smarter and smoother user experiences, including enhanced voice interactions and AI imaging.
Gaming performance is also set to improve substantially. The Dimensity 9500 will likely incorporate Arm’s latest Mali-G1 Ultra GPU, offering major gains in graphics performance and mobile ray tracing. This will provide more realistic visuals and a smoother, more immersive experience for mobile gamers.
At MWC 2025 in March, Jeff Chen mentioned that customer adoption of the Dimensity 9500 has been stronger than its predecessor, the Dimensity 9400, reflecting growing recognition of MediaTek’s technological capabilities. The first smartphones featuring the Dimensity 9500, expected from Vivo, will be released shortly after the official launch.
ICgoodFind : The Dimensity 9500 brings cutting-edge process technology and powerful performance, positioning MediaTek to capture more share in the high-end mobile market.
