Technical parameters/power supply voltage (DC): 2.70V (min)
Technical parameters/number of pins: 64
Technical parameters/dissipated power: 665 mW
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -25 ℃
Technical parameters/dissipated power (Max): 665 mW
Technical parameters/power supply voltage: 2.7V ~ 5.5V
Technical parameters/power supply voltage (Max): 5.5 V
Technical parameters/power supply voltage (Min): 2.7 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: TFBGA-64
External dimensions/packaging: TFBGA-64
Physical parameters/operating temperature: -25℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Cut Tape (CT)
Other/Manufacturing Applications: Commercial, Business, Communications&Networking, -, Communications and Networking
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA8026ET/C2,518
|
NXP | 完全替代 | TFBGA-64 |
Smart Card Interface 20MHz 3.3V/5V 665mW T/R 64Pin TFBGA
|
||
TDA8026ET/C2,557
|
NXP | 完全替代 | TFBGA-64 |
Smart Card Interface 20MHz 3.3V/5V 665mW Tray 64Pin TFBGA
|
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