Technical parameters/dissipated power: 665 mW
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -25 ℃
Technical parameters/dissipated power (Max): 665 mW
Technical parameters/power supply voltage: 2.7V ~ 5.5V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: TFBGA-64
External dimensions/packaging: TFBGA-64
Physical parameters/weight: 106.2024368 mg
Physical parameters/operating temperature: -25℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: -
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA8026ET/C2,551
|
NXP | 完全替代 | TFBGA-64 |
NXP TDA8026ET/C2,551 专用接口, I2C, 销售点终端, 多SAM接触式读卡器, 2.7 V, 5.5 V, TFBGA, 64 引脚
|
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