Technical parameters/dissipated power: | 665 mW |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -25 ℃ |
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Technical parameters/dissipated power (Max): | 665 mW |
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Technical parameters/power supply voltage: | 2.7V ~ 5.5V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 64 |
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Encapsulation parameters/Encapsulation: | TFBGA-64 |
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Dimensions/Packaging: | TFBGA-64 |
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Physical parameters/operating temperature: | -25℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Other/Manufacturing Applications: | - |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA8026ET/C2,551
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NXP | 完全替代 | TFBGA-64 |
NXP TDA8026ET/C2,551 专用接口, I2C, 销售点终端, 多SAM接触式读卡器, 2.7 V, 5.5 V, TFBGA, 64 引脚
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