Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSOP-6
External dimensions/width: 1.65 mm
External dimensions/packaging: TSOP-6
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SI3458BDV-T1-E3
|
Vishay Semiconductor | 类似代替 | TSOP |
N通道60 -V (D -S )的MOSFET N-Channel 60-V (D-S) MOSFET
|
||
SI3458BDV-T1-E3
|
VISHAY | 类似代替 | TSOP-6 |
N通道60 -V (D -S )的MOSFET N-Channel 60-V (D-S) MOSFET
|
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