Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSOP-6
External dimensions/packaging: TSOP-6
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SI3481DV-T1-E3
|
Vishay Siliconix | 类似代替 | TSOT-23-6 |
MOSFET P-CH 30V 4A 6-TSOP
|
||
SI3483CDV-T1-E3
|
Vishay Semiconductor | 类似代替 | TSOP |
Trans MOSFET P-CH 30V 6.1A 6Pin TSOP T/R
|
||
SI3483CDV-T1-GE3
|
VISHAY | 类似代替 | TSOP-6 |
Trans MOSFET P-CH 30V 6.1A 6Pin TSOP T/R
|
||
SI3483CDV-T1-GE3
|
Vishay Siliconix | 类似代替 | TSOT-23-6 |
Trans MOSFET P-CH 30V 6.1A 6Pin TSOP T/R
|
||
SI3483CDV-T1-GE3
|
Vishay Intertechnology | 类似代替 |
Trans MOSFET P-CH 30V 6.1A 6Pin TSOP T/R
|
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