Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 40 ℃
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 2.7 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: BGA-24
External dimensions/packaging: BGA-24
Physical parameters/operating temperature: 40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL512SAGBHI310
|
Cypress Semiconductor | 功能相似 | BGA-24 |
SPANSION S25FL512SAGBHI310 闪存, 或非, 512 Mbit, 133 MHz, SPI, BGA, 24 引脚
|
||
S25FL512SAGBHI310
|
Spansion | 功能相似 | BGA |
SPANSION S25FL512SAGBHI310 闪存, 或非, 512 Mbit, 133 MHz, SPI, BGA, 24 引脚
|
||
S25FL512SAGBHID13
|
Spansion | 类似代替 | BGA |
NOR Flash Serial 3V/3.3V 512M-bit 512M/256M/128M x 1/2Bit/4Bit 8ns 24Pin BGA T/R
|
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