Technical parameters/power supply voltage (DC): 2.70V (min)
Technical parameters/number of pins: 24
Technical parameters/clock frequency: 133 MHz
Technical parameters/memory capacity: 64000000 B
Technical parameters/access time (Max): 14.5 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.7V ~ 3.6V
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 2.7 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: BGA-24
External dimensions/packaging: BGA-24
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Other/Manufacturing Applications: Industrial, computer and computer peripherals, consumer electronics, communication and networking
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL512SAGBHI310
|
Cypress Semiconductor | 功能相似 | BGA-24 |
SPANSION S25FL512SAGBHI310 闪存, 或非, 512 Mbit, 133 MHz, SPI, BGA, 24 引脚
|
||
S25FL512SAGBHI310
|
Spansion | 功能相似 | BGA |
SPANSION S25FL512SAGBHI310 闪存, 或非, 512 Mbit, 133 MHz, SPI, BGA, 24 引脚
|
||
S25FL512SAGBHI313
|
Spansion | 类似代替 | BGA |
NOR Flash Parallel/Serial 3V/3.3V 512Mbit 8ns 24Pin BGA T/R
|
||
|
|
Cypress Semiconductor | 类似代替 | BGA-24 |
NOR Flash Parallel/Serial 3V/3.3V 512Mbit 8ns 24Pin BGA T/R
|
||
S25FL512SAGBHID13
|
Spansion | 功能相似 | BGA |
IC FLASH 512Mbit 133MHz 24BGA
|
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