Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL512SAGBHI310
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Cypress Semiconductor | 功能相似 | BGA-24 |
SPANSION S25FL512SAGBHI310 闪存, 或非, 512 Mbit, 133 MHz, SPI, BGA, 24 引脚
|
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S25FL512SAGBHI310
|
Spansion | 功能相似 | BGA |
SPANSION S25FL512SAGBHI310 闪存, 或非, 512 Mbit, 133 MHz, SPI, BGA, 24 引脚
|
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