Technical parameters/power supply voltage (DC): 2.70V (min)
Technical parameters/power supply current: 100 mA
Technical parameters/number of pins: 24
Technical parameters/clock frequency: 133 MHz
Technical parameters/memory capacity: 32000000 B
Technical parameters/access time (Max): 8 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 2.7 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: BGA-24
External dimensions/packaging: BGA-24
Physical parameters/operating temperature: 40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Other/Manufacturing Applications: Industrial, Consumer Electronics, Computers&Computer Peripherals, Communication and Networking, Industrial, Communications&Networking, Consumer Electronics
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL256SAGBHV200
|
Spansion | 类似代替 | TBGA |
闪存, 串行NOR, 256 Mbit, 32M x 8位, SPI, BGA, 24 引脚
|
||
S25FL256SAGBHV200
|
Cypress Semiconductor | 类似代替 | BGA-24 |
闪存, 串行NOR, 256 Mbit, 32M x 8位, SPI, BGA, 24 引脚
|
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