Encapsulation parameters/Encapsulation: | TBGA |
|
Dimensions/Packaging: | TBGA |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL256SAGBHI200
|
Spansion | 类似代替 | BGA-24 |
闪存, 或非, 串行NOR, 256 Mbit, SPI, BGA, 24 引脚
|
||
S25FL256SAGBHI200
|
Cypress Semiconductor | 类似代替 | BGA-24 |
闪存, 或非, 串行NOR, 256 Mbit, SPI, BGA, 24 引脚
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review