Technical parameters/number of pins: 24
Technical parameters/clock frequency: 133 MHz
Technical parameters/access time (Max): 8 ns
Technical parameters/operating temperature (Max): 105 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.7V ~ 3.6V
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 2.7 V
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: BGA-24
External dimensions/packaging: BGA-24
Physical parameters/operating temperature: -40℃ ~ 105℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL256SAGBHI200
|
Spansion | 类似代替 | BGA-24 |
闪存, 或非, 串行NOR, 256 Mbit, SPI, BGA, 24 引脚
|
||
S25FL256SAGBHI200
|
Cypress Semiconductor | 类似代替 | BGA-24 |
闪存, 或非, 串行NOR, 256 Mbit, SPI, BGA, 24 引脚
|
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